“Probability and Statistics Issues in Wire Fed Additive Manufacturing of Metals”

Gary Harlow, Ph.D.
Professor and Chair
Mechanical Engineering and Mechanics
Lehigh University

Friday, Oct. 20, 3:15 pm
Sidney & Marian Green Classroom (3550 MEK)
Reception to follow at 4:15 pm

Abstract: Wire fed additive manufacturing consisting of layers of deposited metal exhibits variability in composition, microstructure, and mechanical properties. Such processes are being considered for producing structurally significant parts for aircraft, for example. One of the objectives is to statistically characterize critical material properties of the build to make comparisons with wrought material. A scientifically based probability and statistics model is proposed for estimation and prediction of the yield stress, which is a critical variable for structural design applications. The primary purpose of this approach is to estimate the yield stress especially in the extreme lower tail which is critical for high reliability estimation and prediction. To manage uncertainty and improve the estimation of the yield stress, an established methodology for calibration of the distribution function for the yield stress using experimental data is applied.

Bio: Dr. Gary Harlow is currently professor and chair for the Department of Mechanical Engineering and Mechanics at Lehigh University. He received his B.S., in mathematics at Western Kentucky University, his M.S. in applied mathematics at Cornell Univesrity, and his Ph.D., also in applied mathematics at Cornell. Harlow pursues research interests in the areas of probability and statistical modeling of failure processes in materials, aluminum alloys, steels, and composites; stochastic fracture mechanics; mechanical and system reliability; applications of stochastic processes; and, applied probability modeling. He is a recipient of the SAE “Excellence in Oral Presentation” award as well as Lehigh’s Pi Tau Sigma “Professor of the Year” award, and he’s earned research fellowships with Naval Research Center. He is a member ASME, TMS, SAE, Sigma Xi , Sigma Pi Sigma, and Pi Mu Epsilon.